Webb13 jan. 2024 · The iBond5000 Dual enables fine aluminum and gold wire wedge or ribbon bonding. A Patented N-EFO generates the ball bond for gold or copper ball bonding and a unique swing arm simplifies changeover between modes. Modes include: Ball, bump and wedge bonding gold wires: 17-70 microns diameter. Wedge bonding aluminum wires: … The iBond5000 Dual ball and wedge wire bonder is an advanced convertible wedge and ball bonder used for process development, production, research, and supplemental manufacturing support. The iBond5000 Dual enables ball and wedge wire bonder fine aluminum and gold wire wedge or ribbon bonding utilizing a deep access wire feed system.

iBond5000 Dual – Convertible Ball and Wedge Wire Bonder

WebbBall, Bump & Wedge bonding gold wires: 17-70 microns dia. Wedge Bonding Aluminium Wires: 20-75 microns dia. Ball bonding copper wires: 17-50 microns dia. Ribbon … Webb13 jan. 2024 · IBond5000 Dual Ball and Wedge Wire Bonder. Our clients love the flexibility of the iBond5000 Dual Ball and Wedge Wire Bonder! This powerful system performs … magic years educational society

iBond5000 Dual – Convertible Ball and Wedge Wire Bonder

WebbThe iBond5000 Dual ball and wedge wire bonder is an advanced convertible wedge and ball bonder used for process development, production, research, and supplemental manufacturing support. The iBond5000 Dual enables ball and wedge wire bonder fine aluminum and gold wire wedge or ribbon bonding utilizing a deep access wire feed … WebbiBond5000-Dual Technical Specifications Machine Specifications • Ball-wedge and wedge-wedge bonding capability • Wire feed angle 90 degrees, vertical feed / wedge 30 degrees, 45 degrees • Gold wire diameter • Ball bonding and wedge bonding - 0.7 mil to 3.0 mil diameter - 17 micron to 75 micron diameter • Copper Wire • 10 Webbbond5000 是一台先进的球焊/楔焊一体机，可以为工艺研发，生产制造或者附加制造提供有力的技术支持。. 每种键合应用的高收率和优异的重复性，包括：光学器件、MCM 多 … ny state tax late payment penalty calculator